Emery (green silicon carbide)

Product application:

Wire cutting of semiconductor silicon wafer and sapphire crystal

Rough grinding of optical filter and quartz lens

Process advantages:

Each kind of grinding powder / sand we provide is subject to strict particle size control and professional processing technology to ensure that the machined surface has good grinding effect under the condition of high cutting force. It has uniform particle size and high purity. It can provide high-precision micro powder independently according to the customer's individual requirements.

Features of SiC wire cutting products:

1. High purity and large crystal silicon carbide raw materials ensure the excellent cutting performance and stable physical state of silicon carbide cutting powder;

2. The particle size shape is equal product and the edge edge ensures the balance of SiC powder as cutting edge material, so as to minimize the TTV of the material to be cut;

3. The particle size distribution is concentrated and uniform;

4. It has high thermal shock stability and load softening temperature, ensuring the small linear expansion coefficient during load cutting, ensuring the stability of cutting, and has good adaptability with the cutting machine;

5. The surface is specially treated. The micro powder has large specific surface area and clean appearance, and has good adaptability to cutting fluids such as polyethylene glycol.

Features of silicon carbide fine grinding products:

1. Strict particle size control reduces the scratches in the fine grinding process of SiC particles.

2. According to European standards and Japanese standards, the stable supply of products is ensured.